How PVD Vacuum metalizing is done?
Parts are sprayed with a basecoat (becoming obsolete in new technology with highly polished molds using amorphous materials).
Parts are racked, racks put into the chamber, the chamber is then sealed.
Argon gas( or other gas) is introduced into the chamber in a continuously flowing manner.
Electricity creates an active Argon plasma field in front of the cathode. (The cathode is an assembly which contains magnets and provides a mounting for the target - a plate of the material which will be deposited. The magnets are located behind the target.)
The positively charged (ionized) Argon atoms are accelerated by passing through a magnetic field (created by magnets inside the cathode).
The positive atoms are attracted to the negative charged cathode which contains the target.
The target is bombarded with each ion particle, they individually break off ("chip") an atom of the target material with each collision (target hit continuously).
Continuous (and directed) sputtering of the release target atoms are "shot" onto the surface of the part (direction is assisted by the magnetic field - perpendicular to the target.