PVD vacuum evaporation coating

  PVD vacuum evaporation coating

  I. Overview

  Vacuum evaporation coating (abbreviated as evaporation) is a technology that uses an evaporator to heat the evaporated substance to vaporize it, and the evaporated particle stream is directed to the substrate, and a solid thin film is deposited on the substrate. Evaporation is the earliest development of physical meteorological deposition (PVD) technology and is widely used. Although sputtering and ion plating developed later are superior to evaporation in many aspects, vacuum evaporation coating technology still has many advantages. For example, the equipment and process are relatively simple, and very pure film can be deposited. Therefore, vacuum evaporation coating is still a very important coating technology today. In recent years, technologies such as electron bombardment evaporation, high-frequency induction evaporation and laser evaporation have been widely used in evaporation coating technology, making this technology more perfect.

  2. Principle of vacuum evaporation coating

  1. Place the membrane material in the evaporation source in the vacuum chamber and evaporate by heating the evaporation source under high vacuum conditions. After the atoms and molecules of the membrane material vapor escape from the surface of the evaporation source, the average free After the process is larger than the linear size of the vacuum chamber, it is rarely collided and hindered by other molecules or atoms, and can directly reach the surface of the substrate to be plated. Due to the low temperature of the substrate, the evaporated film vapor particles condense on it. Filming.

  2. During the evaporation coating process, the particles evaporated from the surface of the film material move in a straight line in space at a certain speed until they collide with other particles. In the vacuum chamber, when the particle concentration in the weather and the pressure of the residual gas are low enough, these particles can maintain a straight flight from the evaporation source to the substrate, otherwise they will collide and change the direction of movement. For this reason, it is necessary to increase the mean free path of the residual gas to reduce the probability of collision with the evaporated particles. It is necessary to evacuate the vacuum chamber to a high vacuum. At the distance, sufficient vacuum conditions will be obtained.

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