PVD magnetron sputtering coating
One: Principle of Magnetron Sputtering
The phenomenon in which high-energy particles (usually positive ions accelerated by an electric field) bombard and penetrate the solid surface, the atoms and molecules on the solid surface exchange kinetic energy with the incident high-energy particles and splash out from the solid surface is called magnetron sputtering. The sputtered atoms (or groups of atoms) have a certain energy, and they can be redeposited and condensed on the surface of the solid substrate to form a thin film, which is called sputter coating. Generally, gas discharge is used to generate gas ionization. The positive ions bombard the target material at high speed under the action of an electric field, knock out the atoms or molecules of the halogen target material, and fly to the metal conductive film deposited on the surface of the plated substrate.
Two: The growth principle of thin film
Among the sputtered particles that are broken down by ion bombardment on the target, the positive ions cannot easily reach the plated substrate due to the reverse electric field, and the remaining particles will migrate to the plated substrate. The coloring gas pressure of sputtering coating is close to 2.0*10-1pa~4.0*10-1pa, and the mean free path of particles is about 1~10cm, so the spatial distance between the target and the substrate should be approximately the same as this range. Otherwise, the particles will collide multiple times during the migration process, which will reduce the energy of the target atoms and increase the scattering loss of the target. It is easy to cause uneven coloring and insufficient surface brightness of the coated substrate.